Contactless VLSI Measurement and Testing Techniques

The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing.

Autorul evidentiaza dificultatile inerente intampinate cu sondele mecanice si abordarile de proiectare a testabilitatii pentru testarea functionala si interna a defectiunilor si arata cum testarea fara contact ar putea rezolva multe dintre provocarile asociate cu testarea conventionala a napolitanelor.