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In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.
EdituraTaylor & Francis Ltd
Dimensiuni246 x 174
Data Publicarii26/12/2025
FormatNecartonata
Numar pagini132
Aceasta este o carte in limba engleza. Descrierea cartii (tradusa din engleza cu Google Translate) este in limba romana din motive legale.