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This book is a comprehensive overview of the discoveries in composition, growth and control of gold-aluminum intermetallic compounds in microelectronic interconnects. It focuses on the history of detection, theory and understanding of the gold/aluminum interface reliability issues.
EdituraTaylor & Francis Ltd
Dimensiuni234 x 156
Data Publicarii01/12/2025
FormatCartonata
Numar pagini132
Aceasta este o carte in limba engleza. Descrierea cartii (tradusa din engleza cu Google Translate) este in limba romana din motive legale.