Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Autor: Cheng, Jie

Disponibilitate: LIVRARE IN 3-5 SAPTAMANI (produsul este livrat din Marea Britanie)
SKU:
9789811355851

680.99 RON
Okian.ro este o LIBRARIE online de carte in limba engleza.

CITESTE MAI MULT

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Descriere RO

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.